Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The latest advances in three-dimensional integrated circuit stacking technology
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:
High density through silicon stacking (TSS) technology
Practical design ecosystem for heterogeneous 3D IC products
Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
Process integration for TSV manufacturing
High-aspect-ratio silicon etch for TSV
Dielectric deposition for TSV
Barrier and seed deposition
Copper electrodeposition for TSV
Chemical mechanical polishing for TSV applications